Module metrology log info
Condition ID
Condition ID
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Measurement date
Measurement date
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2025-06-12 14:38:44
2025-06-12 14:38:44
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Test log info
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2025-06-12 14:38:48
2025-06-12 14:38:48
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Stored files
DCA uploads
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Uploaded file path
Uploaded file path
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Comments
In Spec. Some glue residue found on bottom SE, did not affect pat rec. Minor chips from sandwich jig, pictures uploaded by Aloke from recetion station.