GABRIEL
activity
periodic activity
sensor assembly
module assembly
module management
DCA
OMPO
planning
assembly
all
kapton/HV gluing
wire bonding
sandwich gluing
carrier attachment
hybrid gluing
VTRx+ attachment
VTRx+ shield gluing
encapsulation
glue
stations
manipulations
bonding settings
measurements
all
vi parts
vi batch
iv tests
dicing angle
module metrology
pull test
encapsulation height
hybrid r/o
module r/o
burn-in
flow
methods
environment
parts & consumables
part list
part types
part inventory
part attributes
batch receive(d)
batch types
batch inventory
batch report items
consumable arrivals
consumable inventory
consumable types
consumable wirebonding
shipments
DCA incoming
DCA outgoing
DCA sync part(s)
manage outgoing
issues
register
login
Visual Inspection log info
Log ID
Log ID
Measure date
Measure date
Test ID
Test ID
PhotoDB tag
PhotoDB tag
Options
Options
336
336
2025-07-17 15:08:00
2025-07-17 15:08:00
1900
1900
UID_ImYAPGQ8jk
UID_ImYAPGQ8jk
Test log info
Log ID
Log ID
Log date
Log date
Part name
Part name
Test type
Test type
Station
Station
Operator
Operator
In Spec
In Spec
1900
1900
2025-07-17 15:13:41
2025-07-17 15:13:41
36700_036_2-S_MAIN0
36700_036_2-S_MAIN0
Visual inspection
Visual inspection
IV1
IV1
Tahys
Tahys
Comments
Small chip in 1 corner
Pictures
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