Wirebonding log info

Log ID
 
Assembly date
 
Part name
 
Assembly type
 
Operator
 
Options
 
222
 
2025-06-30 14:23:00
 
Aloke
 
 

Settings

Touchdown

Sensor
Hybrid
Start Height
 
800
 
800
 
μm
 
Area
 
200
 
200
 
μm
 
Lower Tolerance
 
100
 
100
 
μm
 
Velocity
 
2000
 
2000
 
μm/s
 
Force
 
10
 
10
 
cN
 
Tail Offset
 
0
 
0
 
μm
 

Bonding

Sensor
Hybrid
Overtravel
 
25
 
25
 
μm
 
Delay
 
0
 
0
 
ms
 

Loop

Sensor
Hybrid
Leave Angle
 
45
 
45
 
deg
 
Intermediate Height
 
100
 
100
 
μm
 
Intermediate Radius
 
100
 
100
 
μm
 
Reverse Distance
 
0
 
0
 
μm
 
Vertical Distance
 
0
 
0
 
μm
 
Shape Source
 
70
 
70
 
%
 
Method
 
Loop height source
 
Loop height source
 
 
Height
 
(150)(400/450/500)(400/500)
 
(150)(400/450/500)(400/500)
 
μm
 
Height Correction
 
0
 
0
 
%
 
Shape Dest
 
70
 
70
 
%
 
Intermediate Height (method)
 
Direct
 
Direct
 
 
Horizontal Distance
 
0
 
0
 
μm
 

Welding

Sensor
Hybrid
Process Control
 
Const. ultrasonic
 
Const. ultrasonic
 
 
Minimum Time
 
0
 
0
 
ms
 
Stop After Deformation
 
40
 
40
 
%
 
No of intervals
 
2
 
2
 
 

Welding Interval 1

Ultrasonic
 
8
 
10
 
%
 
Bondsforce
 
16
 
24
 
cN
 
Duration
 
2
 
2
 
ms
 
Ramp
 
0
 
0
 
ms
 

Welding Interval 2

Ultrasonic
 
16
 
18
 
%
 
Bondsforce
 
20
 
25
 
cN
 
Duration
 
98
 
98
 
ms
 
Ramp
 
0
 
0
 
ms
 

Comments

Bottom side, strip 1260 has wire bonded at the very edge of hybrid pad. This happened due to the issue of the wedge tool position offset. Bonds seems to be always little right side of the program bond location.